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Thermal paste AG SILVER, 3.8 W/mK

€8.00
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  • High Thermal Conductivity: AG Silver Paste is enriched with silver compounds, providing thermal conductivity of >3.8 W/mK. This effectively dissipates heat, which is crucial for the optimal operation of your equipment. The paste is silver-colored, visually emphasizing its advanced technology.
  • Versatile application: Ideal for filling micro-irregularities between contact elements such as the processor and heatsink. It also excels as a heat transfer medium from the heat pipe condenser to the exchanger in vacuum solar collectors. Its universal application makes it indispensable in computers and advanced heating systems.
  • Low thermal impedance and thermal stability: With a thermal impedance of less than 0.067 °C in²/W, AG Silver Paste minimizes thermal resistance, leading to better cooling and longer component lifespan. It operates effectively over a wide temperature range from -50°C to 250°C, and temporarily up to 340°C, making it perfect for high-reliability applications in extreme conditions.
  • Physical and chemical properties: AG Silver Paste has a density of 2.37 g/cm³ at 20°C and extremely low evaporation (<0.001%), ensuring long-lasting effectiveness. Its viscosity prevents it from flowing, and the thixotropic index of 380 +/- 10 allows for easy spreading. The volume resistivity is 2.9 x 10¹³ Ohm x cm, providing excellent electrical insulation. The dielectric loss factor tg δ at f=120 Hz is less than 0.001, and the relative permittivity εr at f=120 Hz is 13.9, further highlighting its advanced dielectric properties. Electrical strength is 500 V/mm.
1100500
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